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Forward. Preface. Acknowledgements. Introduction. Part A: The framework. MCM package selection: a materials and manufacturing perspective. MCM package selection: a systems need perspective. MCM package selection: cost issues. Part B: The basics. Laminate-based technologies for multichip modules. Thick film and ceramic technologies for hybrid multichip modules. Thin film multilayer interconnection technologies for multichip modules. Selection criteria for multichip module dielectrics. Chip-to-substrate (first level) connection technology options. MCM-to-printed wiring board (second level) connection technology options. Electrical design of digital multichip modules. Thermal design considerations for multichip module applications. Electrical testing of multichip modules. Part C: Case studies. The development of Unisys multichip modules. High performance aerospace multichip module technology development at Hughes. Silicon-based multichip modules. The technology and manufacture of the VAX-9000 multichip unit. Part D: Closing the loop. Complementing technologies for MCM success. Epilogue. Index.
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Add Multichip Module Technologies and Alternatives: The Basics, The first book to provide a framework for understanding the multichip module (MCM) technologies available for package selection. This volume will be relied on by engineers concerned with the design and systems integration of new products and technical man, Multichip Module Technologies and Alternatives: The Basics to the inventory that you are selling on WonderClubX
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Add Multichip Module Technologies and Alternatives: The Basics, The first book to provide a framework for understanding the multichip module (MCM) technologies available for package selection. This volume will be relied on by engineers concerned with the design and systems integration of new products and technical man, Multichip Module Technologies and Alternatives: The Basics to your collection on WonderClub |