Mems/Moems Advances in Photonic Communications, Sensing, Metrology, Packaging and Assembly Book

	Conference Committees
	Optical MEMS and MOEMS for telecommunications	1
	Novel low-cost and simple fabrication technology for tunable dielectric active and passive optical air-gap devices
	Continuously tunable InP-based multiple air-gap MOEMS filters with ultrawide tuning range	21
	Micromachined two-chip, low-cost tunable filters for WDM	30
	Design, manufacture, and reliability of 2D MEMS optical switches	39
	Realization of a spectrometer with micromachined scanning grating	46
	Micromachined poly-SiGe bolometer arrays for infrared imaging and spectroscopy	54
	Micro all-optical and optoelectronic devices	64
	Characterization of MEMS structures by microscopic digital holography	71
	Interferometry system for the mechanical characterization of membranes with silicon oxynitride thin films fabricated by PECVD	79
	Gripping tool for MEMS assembly with an absolute distance measurement sensor using a fiber optic WL interferometer with high measuring frequency	85
	Assessment of vacuum casting replication technology for refractive and diffractive micro-optomechanical components	96
	Arrays of spherical micromirrors and molded microlenses fabricated with bulk Si micromachining	107
	Variants of LIGA technology for the production of plastic microcomponents	112
	Lithographic performance of an ASML i-line step-and-repeat system by using photosensitive Durimides	122
	One-step lithography for fabrication of a hybrid microlens array using a coding gray-level mask	130
	Thermal strain analysis for flip chip packaging	138
	Nonmigration conductive adhesive	146
	Calibration of a 2D piezoresistive stress sensor in (100) silicon using a 4PB fixture	155
	Algorithmic solutions for thermal and electrostatic simulation of MEMS	159
	Highly thermally conductive substrates with adjustable CTE for diode laser bar packaging	174
	Experimental study of external heat sinks attached on an optical parallel fiber module	186
	Investigation of interfacial behavior of a Si-epoxy-FR4 structure under thermal testing using moire interferometry	197
	Author Index	203