Mechanics Of Solder Alloy Interconnects Book

Name: Mechanics Of Solder Alloy Interconnects, The Mechanics of Solder
Brand: Steidl Publishing
SKU: 9780442015053
Price: 262.84 USD
Availability: InStock
Rating: 3 (2 reviews)

2 Ratings

Mechanics Of Solder Alloy Interconnects, The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gain, Mechanics Of Solder Alloy Interconnects

3 out of 5 stars based on 2 reviews

Mechanics Of Solder Alloy Interconnects
Written by author Darrel R. Frear
Published by Springer-Verlag New York, LLC, January 1994
The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gain
The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gain

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Book Categories

Authors

Foreword
Acknowledgment
Chapter Authors and Affiliations
1 Introduction: The Mechanics of Solder Alloy Interconnect 1
2 Microstructural Influences on the Mechanical Properties of Solder 7
3 Interfaces and Intermetallics 42
4 Constitutive Models 87
5 Prediction of Solder Joint Geometry 158
6 Life Prediction and Accelerated Testing 199
7 Thermomechanical Modeling of Solder Joints - Numerical Considerations 314
8 Applications - Through-Hole 336
9 Surface Mount Solder Joints under Thermal, Mechanical, and Vibration Conditions 361
Index 416

Title: Mechanics Of Solder Alloy Interconnects

Manufacturer:

Steidl Publishing

Item Number: 9780442015053

Publication Date: January 1994

Number: 1

Product Description: Mechanics Of Solder Alloy Interconnects

Universal Product Code (UPC): 9780442015053

WonderClub Stock Keeping Unit (WSKU): 9780442015053

Rating: 3/5 based on 2 Reviews

Image Location: https://wonderclub.com/images/covers/50/53/9780442015053.jpg

Category: Media >> Books

Weight: 0.200 kg (0.44 lbs)

Width: 1.130 cm (0.44 inches)

Heigh : 6.000 cm (2.36 inches)

Depth: 9.000 cm (3.54 inches)

Date Added: August 25, 2020, Added By: Ross

Date Last Edited: August 25, 2020, Edited By: Ross

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Mechanics Of Solder Alloy Interconnects, The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gain, Mechanics Of Solder Alloy Interconnects

Add Mechanics Of Solder Alloy Interconnects, The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gain, Mechanics Of Solder Alloy Interconnects to the inventory that you are selling on WonderClub

Add Mechanics Of Solder Alloy Interconnects, The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gain, Mechanics Of Solder Alloy Interconnects to your collection on WonderClub

Mechanics Of Solder Alloy Interconnects Book

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	Foreword
	Acknowledgment
	Chapter Authors and Affiliations
1	Introduction: The Mechanics of Solder Alloy Interconnect	1
2	Microstructural Influences on the Mechanical Properties of Solder	7
3	Interfaces and Intermetallics	42
4	Constitutive Models	87
5	Prediction of Solder Joint Geometry	158
6	Life Prediction and Accelerated Testing	199
7	Thermomechanical Modeling of Solder Joints - Numerical Considerations	314
8	Applications - Through-Hole	336
9	Surface Mount Solder Joints under Thermal, Mechanical, and Vibration Conditions	361
	Index	416