Fundamentals of Semiconductor Processing Technology Book

1	Semiconductor Crystals	1
1.1	Crystals and Crystallographic Orientations	2
1.2	The Silicon Crystal	6
1.3	Wafer Preparation	23
1.4	Compound Semiconductors	27
2	Thermal Oxidation and Nitridation	39
2.1	SiO[subscript 2] and SiO[subscript 2]-Si Interface	40
2.2	Thermal Oxidation	44
2.3	Silicon Nitride	68
3	Thin Film Deposition	87
3.1	Chemical Vapor Deposition	88
3.2	Chemical-Physical Deposition Processes	123
3.3	Physical-Vapor Deposition	135
4	Lithography	169
4.1	Optical Lithography	170
4.2	Resolution Enhancement Techniques	217
4.3	Electron-Beam Lithography	227
4.4	X-Ray Lithography	234
4.5	Ion-Beam Lithography	245
5	Contamination Control and Etch	261
5.1	Clean Processes	261
5.2	Etching	272
6	Ion Implantation	353
6.1	Principle of Operation	355
6.2	Energy Loss and Range Distribution	376
6.3	Crystal Damage and Dopant Activity	416
7	Diffusion	467
7.1	Point Defects	470
7.2	Fick's Laws	473
7.3	Non-Constant Diffusivity	482
7.4	Diffusion in Polysilicon	502
7.5	Diffusion in Insulators	505
7.6	Diffusion Sources	509
7.7	Gettering in Silicon	511
8	Contact and Interconnect Technology	527
8.1	Contact Metallurgy	529
8.2	Poly-Metal Dielectrics	546
8.3	Metal Interconnects	551
8.4	Inter-Level Dielectrics	565
8.5	Multi-Level Metals	571
8.6	Reliability Considerations	572