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Book Categories |
Preface | ||
1 | Chemical Mechanical Planarization - An Introduction | 1 |
2 | Historical Motivations for CMP | 15 |
3 | CMP Variables and Manipulations | 36 |
4 | Mechanical and Electrochemical Concepts for CMP | 48 |
5 | Oxide CMP Processes - Mechanisms and Models | 129 |
6 | Tungsten and CMP Processes | 181 |
7 | Copper CMP | 209 |
8 | CMP of Other Materials and New CMP Applications | 269 |
9 | Post-CMP Cleanup | 289 |
Appendix | Problem Sets | 306 |
Index | 317 |
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Add Chemical Mechanical Planarization of Microelectronic Materials, Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relativ, Chemical Mechanical Planarization of Microelectronic Materials to the inventory that you are selling on WonderClubX
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Add Chemical Mechanical Planarization of Microelectronic Materials, Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relativ, Chemical Mechanical Planarization of Microelectronic Materials to your collection on WonderClub |