Reviews for Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS

The average rating for Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS based on 2 reviews is 3 stars.

Review # 1 was written on 2016-10-27 00:00:00 Steve Velner Looking back after a decade and a half: a lot of good insights, a lot of missed guesses, and some exciting ideas that sadly got lost along the way.

Review # 2 was written on 2020-08-29 00:00:00 Ron Ramsden I used this book for a Digital Electronics course that I taught.