Interconnect Technology and Design for Gigascale Integration Book

Name: Interconnect Technology and Design for Gigascale Integration, Thi
Brand: Steidl Publishing
SKU: 9781402076060
Price: 159.20 USD
Availability: InStock
Rating: 4 (2 reviews)

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Interconnect Technology and Design for Gigascale Integration, This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architec, Interconnect Technology and Design for Gigascale Integration

4 out of 5 stars based on 2 reviews

Interconnect Technology and Design for Gigascale Integration
Written by author Jeffrey A. Davis
Published by Springer-Verlag New York, LLC, July 2008
This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architec
The International Technology Roadmap for Semiconductors (ITRS) projects that by 2011 over one billion transistors will be integrated into a single monolithic die. The wiring system of this billion-transistor die will deliver power to each transistor, prov

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Preface
1 Interconnect Opportunities for GSI 1
2 Copper BEOL Interconnects for Silicon CMOS Logic Technology
3 Interconnect Parasitic Extraction of Resistance, Capacitance, and Inductance 67
4 Distributed RC and RLC Transient Models 111
5 Power, Clock, and Global Signal Distribution 159
6 Stochastic Multilevel Interconnect Modeling and Optimization 219
7 Interconnect-Centric Computer Architectures 263
8 Chip-to-Module Interconnect 293
9 3-D ICs DSM Interconnect Performance Modeling and Analysis 323
10 Silicon Microphotonics 383

Title: Interconnect Technology and Design for Gigascale Integration

Manufacturer:

Steidl Publishing

Item Number: 9781402076060

Publication Date: July 2008

Number: 1

Product Description: Interconnect Technology and Design for Gigascale Integration

Universal Product Code (UPC): 9781402076060

WonderClub Stock Keeping Unit (WSKU): 9781402076060

Rating: 4/5 based on 2 Reviews

Image Location: https://wonderclub.com/images/covers/60/60/9781402076060.jpg

Category: Media >> Books

Weight: 0.200 kg (0.44 lbs)

Width: 9.210 cm (3.63 inches)

Heigh : 6.140 cm (2.42 inches)

Depth: 0.940 cm (0.37 inches)

Date Added: August 25, 2020, Added By: Ross

Date Last Edited: August 25, 2020, Edited By: Ross

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Interconnect Technology and Design for Gigascale Integration, This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architec, Interconnect Technology and Design for Gigascale Integration

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Add Interconnect Technology and Design for Gigascale Integration, This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architec, Interconnect Technology and Design for Gigascale Integration to your collection on WonderClub

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	Preface
1	Interconnect Opportunities for GSI	1
2	Copper BEOL Interconnects for Silicon CMOS Logic Technology
3	Interconnect Parasitic Extraction of Resistance, Capacitance, and Inductance	67
4	Distributed RC and RLC Transient Models	111
5	Power, Clock, and Global Signal Distribution	159
6	Stochastic Multilevel Interconnect Modeling and Optimization	219
7	Interconnect-Centric Computer Architectures	263
8	Chip-to-Module Interconnect	293
9	3-D ICs DSM Interconnect Performance Modeling and Analysis	323
10	Silicon Microphotonics	383