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| Preface | ||
| 3-D Interconnection Microsystems Applications | ||
| High Performance Packaging with Multilayer Ceramic Modules | ||
| High Frequency LTCC Modules | ||
| Analysis and Optimization of Circuit Interconnect Performance | ||
| High Performance Interconnect on Cofired Ceramic | ||
| New Aspects in the Reliability Design of High Density Interconnects in MCMs | ||
| MCM-D Technology with Active and Passive Substrates | ||
| High Performance Ceramic Modules and Packages | ||
| Laser Processing in MCM-C Technologies | ||
| LTCC Technology: Where We Are and Where We're Going | ||
| Design and Realization of High Performance Ceramic Heat Sinks | ||
| AIN Cofired MCM-C/D | ||
| Very Fine Line Photoimageable Thick Film Technology Developed at Hybridas, Lithuania | ||
| High-Performance Solid State Mass Memory Modules | ||
| Mass Memory Packaging for Space Applications | ||
| Advanced Multichip Modules for Telecom Applications | ||
| Telecom Applications of MCM Technology | ||
| Design and Realization of a Multichip Module as a Motion Estimator for HDTV-Applications | ||
| Multichip Module Applications in Satellite Communications | ||
| Materials/Design Considerations for MCMs | ||
| MCMs: Material Choices for Electronics and Optoelectronics | ||
| Low Permittivity Porous Silica Thin Films for MCM-C/D Applications | ||
| MCM Passivation Studies for Enhanced Producibility and Reliability | ||
| Buried Thick Film Capacitors Built Up with High-K Dielectrics for MCM Applications | ||
| Advances in Materials for Sensors | ||
| PTC Thick Film Thermistors | ||
| Evaluation of Some Thick Film Materials for Temperature, Force, and Humidity Sensors | ||
| Parameters and Technology of Thick Film Electrolytic SO[subscript 2] Sensors | ||
| Sensors: A Great Chance for Microelectronic Technologies | ||
| High Sensitivity Thermometers for Millikelvin Temperature Range | ||
| Thick Films Based on Glass and Polymeric Matrices, Mechanism of Conductivity | ||
| Author Index | ||
| Keyword Index |
| Price | Condition | Delivery | Seller | Action |
| $290.61 | Digital |
| WonderClub |
Michael Holman
reviewed MCM C/Mixed Technologies and Thick Film Sensors on December 14, 2020
MCM C/Mixed Technologies and Thick Film Sensors
Basic Perspective Drawing: A Visual Approach
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Add MCM C/Mixed Technologies and Thick Film Sensors, Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and , MCM C/Mixed Technologies and Thick Film Sensors to the inventory that you are selling on WonderClubX
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Add MCM C/Mixed Technologies and Thick Film Sensors, Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and , MCM C/Mixed Technologies and Thick Film Sensors to your collection on WonderClub |