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Preface.
Chapter 1: Overview of MEMS and Microsystems.
1.1 MEMS and Microsystem.
1.2 Typical MEMS and Microsystems Products.
1.3 Evolution of Microfabrication.
1.4 Microsystems and Microelectronics.
1.5 The Multidisciplinary Nature of Microsystems Design and Manufacture.
1.6 Microsystems and Miniaturization.
1.7 Application of Microsystems in Automotive Industry.
1.8 Application of Microsystems in Other Industries.
1.9 Markets for Microsystems.
Problems.
Chapter 2: Working Principles of Microsystems.
2.1 Introduction.
2.2 Microsensors.
2.3 Microactuation.
2.4 MEMS with Microactuators.
2.5 Microaccelerometers.
2.6 Microfluidics.
Problems.
Chapter 3: Engineering Science for Microsystems Design and Fabrication.
3.1 Introduction.
3.2 Atomic Structure of Matters.
3.3 Ions and Ionization.
3.4 Molecular Theory of Matter and Inter-molecular Forces.
3.5 Doping of Semiconductors.
3.6 The Diffusion Process.
3.7 Plasma Physics.
3.8 Electrochemistry.
Problems.
Chapter 4: Engineering Mechanics for Microsystems Design.
4.1 Introduction.
4.2 Static Bending of Thin Plates.
4.3 Mechanical Vibration.
4.4 Thermomechanics.
4.5 Fracture Mechanics.
4.6 Thin Film Mechanics.
4.7 Overview on Finite Element Stress Analysis.
Problems.
Chapter 5: Thermofluid Engineering and Microsystems Design.
5.1 Introduction.
5.2 Overview on the Basics of Fluid Mechanics in Macro and Mesoscales.
5.3 Basic Equations in Continuum Fluid Dynamics.
5.4 Laminar Fluid Flow in Circular Conduits.
5.5 Computational Fluid Dynamics.
5.6 Incompressible Fluid Flow in Microconduits.
5.7 Overview on Heat Conduction in Solids.
5.8 Heat Conduction in Multi-layered Thin Films.
5.9 Heat Conduction in Solids in Submicrometer Scale.
Problems.
Chapter 6: Scaling Laws in Miniaturization.
6.1 Introduction to Scaling.
6.2 Scaling in Geometry.
6.3 Scaling in Rigid-Body Dynamics.
6.4 Scaling in Electrostatic Forces.
6.5 Scaling of Electromagnetic Forces.
6.6 Scaling in Electricity.
6.7 Scaling in Fluid Mechanics.
6.8 Scaling in Heat Transfer.
Problems.
Chapter 7: Materials for MEMS and Microsystems.
7.1 Introduction.
7.2 Substrates and Wafers.
7.3 Active Substrate Materials.
7.4 Silicon as a Substrate Material.
7.5 Silicon Compounds.
7.6 Silicon Piezoresistors.
7.7 Gallium Arsenide.
7.8 Quartz.
7.9 Piezoelectric Crystals.
7.10 Polymers.
7.11 Packaging Materials.
Problems.
Chapter 8: Microsystems Fabrication Processes.
8.1 Introduction.
8.2 Photolithography.
8.3 Ion Implantation.
8.4 Diffusion.
8.5 Oxidation.
8.6 Chemical Vapor Deposition.
8.7 Physical Vapor Deposition - Sputtering.
8.8 Deposition by Epitaxy.
8.9 Etching.
8.10 Summary of Microfabrication.
Problems.
Chapter 9: Overview of Micromanufacturing.
9.1 Introduction.
9.2 Bulk Micromanufacturing.
9.3 Surface Micromachining.
9.4 The LIGA Process.
9.5 Summary on Micromanufacturing.
Problems.
Chapter 10: Microsystem Design.
10.1 Introduction.
10.2 Design Considerations.
10.3 Process Design.
10.4 Mechanical Design.
10.5 Mechanical Design Using Finite Element Method.
10.6 Design of Silicon Die of a Micropressure Sensor.
10.7 Design of Microfluidics Network Systems.
10.8 Computer-Aided Design.
Problems.
Chapter 11: Assembly, Packaging and Testing of Microsystems.
11.1 Introduction.
11.2 Overview of Microassembly.
11.3 The High Costs of Microassembly.
11.4 Microassembly Processes.
11.5 Major Technical Problems in Microassembly.
11.6 Microassembly Work Cells.
11.7 Challenging Issues in Microassembly.
11.8 Overview of Microsystems Packaging.
11.9 General Considerations in Packaging Design.
11.10 The Three Levels of Microsystems Packaging.
11.11 Interfaces in Microsystems Packaging.
11.12 Essential Packaging Technologies.
11.13 Die preparation.
11.14 Surface Bonding.
11.15 Wire bonding:.
11.16 Sealing and Encapsulation.
11.17 Three-dimensional Packaging.
11.18 Selection of Packaging Materials.
11.19 Signal Mapping and Transduction.
11.20 Design Case on Pressure Sensor Packaging.
11.21 Reliability in MEMS Packaging.
11.22 Testing for Reliability.
Problems.
Chapter 12: Introduction to Nanoscale Engineering.
12.1 Introduction.
12.2 Micro and Nanoscale Technologies.
12.3 General Principle in Nanofabrication.
12.4 Nanoproducts.
12.5 Applications of Nanoproducts.
12.6 Quantum Physics.
12.7 Molecular Dynamics.
12.8 Fluid Flow in Submicrometer and Nano Scales.
12.9 Heat Conduction in Nanoscale.
12.10 Measurement of Thermal Conductivity.
12.11 Challenges in Nanoscale Engineering.
12.12 Social Impacts of Nanoscale Engineering.
Problems.
Bibliography.
Index.
| Price | Condition | Delivery | Seller | Action |
| $140.00 | Digital |
| WonderClub |
Marte Eyre
reviewed MEMS and Microsystems: Design, Manufacture, and Nanoscale Engineering on December 16, 2017 MEMS and Microsystems: Design, Manufacture, and Nanoscale Engineering
I didn't know what to expect when I picked up this book. I found it on the side of the road, and thought, "This would be perfect as one of my required reading nonfiction books for my AP English Class." As I delved into this book, I was happily surprised by its content. The authors of this book start off by explaining the actual disambiguation of nanotechnology. What is Nanotechnology and Why Does it Matter? piqued my interest when the book talked about the role of nanotechnology in economics, warfare, and daily life. The chapters transitioned very nicely from one to another. I found the index was complete and easy to navigate.
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Add MEMS and Microsystems: Design, Manufacture, and Nanoscale Engineering, Technology/Engineering/Mechanical A bestselling MEMS text...now better than ever. An engineering design approach to Microelectromechanical Systems, MEMS and Microsystems remains the only available text to cover both the electrical and the mechanical, MEMS and Microsystems: Design, Manufacture, and Nanoscale Engineering to the inventory that you are selling on WonderClubX
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Add MEMS and Microsystems: Design, Manufacture, and Nanoscale Engineering, Technology/Engineering/Mechanical A bestselling MEMS text...now better than ever. An engineering design approach to Microelectromechanical Systems, MEMS and Microsystems remains the only available text to cover both the electrical and the mechanical, MEMS and Microsystems: Design, Manufacture, and Nanoscale Engineering to your collection on WonderClub |
