Power Integrity Modeling and Design for Semiconductor and Systems (Prentice Hall Modern Semiconductor Design Series) Book

Preface     xiii
Acknowledgments     xvii
About the Authors     xxi
Basic Concepts     1
Introduction     1
Functioning of Transistors     1
What Are the Problems with Power Delivery?     4
Importance of Power Delivery in Microprocessors and ICs     5
Power Delivery Network     6
Transients on the Power Supply     8
Simple Relationships for Power Delivery     10
Core Circuits     10
I/O Circuits     14
Delay Due to SSN     15
Timing and Voltage Margin Due to SSN     16
Relationship between Capacitor and Current     17
Design of PDNs     17
Target Impedance     20
Impedance and Noise Voltage     22
Components of a PDN     24
Voltage Regulator     24
Bypass or Decoupling Capacitors     28
Package and Board Planes     37
On-Chip Power Distribution     42
PDN with Components     45
Analysis of PDNs     45
Single-Node Analysis     48
Distributed Analysis     55
Chip-Package Antiresonance: An Example     61
High-Frequency Measurements     65
Measurement of Impedance     66
Measurement of Self-Impedance     68
Measurement of Transfer Impedance     70
Measurement of Impedance by Completely Eliminating Probe Inductance     70
Signal Lines Referenced to Planes     71
Signal Lines as Transmission Lines     72
Relationship between Transmission-Line Parameters and SSN     74
Relationship between SSN and Return Path Discontinuities     75
PDN Modeling Methodology     77
Summary     79
Modeling of Planes     83
Introduction     83
Behavior of Planes     84
Frequency Domain     84
Time Domain     86
Two-Dimensional Planes     88
Lumped Modeling Using Partial Inductances     89
Extracting the Inductance and Resistance Matrices     90
Distributed Circuit-Based Approaches     94
Modeling Using Transmission Lines     94
Transmission Matrix Method (TMM)     97
Frequency-Dependent Behavior of Unit-Cell Elements     104
Modeling of Gaps in Planes     113
Discretization-Based Plane Models     117
Finite-Difference Method     117
Finite-Difference Time-Domain Method     128
Finite-Element Method     132
Analytical Methods     133
Cavity Resonator Method     133
Network Representation of the Cavity Resonator Model     135
Multiple Plane Pairs     138
Coupling through the Vias     141
Coupling through the Conductors     154
Coupling through the Apertures     158
Summary     169
Simultaneous Switching Noise     175
Introduction     175
Methods for Modeling SSN     175
Simple Models     177
Modeling of Output Buffers     180
Modeling of Transmission Lines and Planes     185
Microstrip Configuration     186
Stripline Configuration     189
Conductor-Backed Coplanar Waveguide Configuration     205
Summary of Modal Decomposition Methods     207
Application of Models in Time-Domain Analysis     209
Plane Bounce from Return Currents     209
Microstrip-to-Microstrip Via Transition     217
Split Planes     222
Application of Models in Frequency-Domain Analysis     226
Stripline between a Power and a Ground Plane     226
Microstrip-to-Stripline Via Transition     228
Reduction of Noise Coupling Using Thin Dielectrics     231
Extension of M-FDM to Incorporate Transmission Lines     233
Analysis of a Complex Board Design     236
Summary     239
Time-Domain Simulation Methods     243
Introduction     243
Rational Function Method     244
Basic Theory     244
Interpolation Schemes     246
Properties of Rational Functions     252
Passivity Enforcement     257
Integration in a Circuit Solver     283
Disadvantages     291
Signal Flow Graphs     295
Causality     296
Transfer-Function Causality     296
Minimum Phase     296
Delay Extraction from Frequency Response     300
Causal Signal Flow Graphs     302
Computational Aspects in SFG     303
Fast Convolution Methods     307
Cosimulation of Signal and Power Using SFGs     312
Modified Nodal Analysis (MNA)     317
What Is MNA?     317
Frequency Domain     318
Time Domain     320
MNA Formulation with S-Parameters     322
Summary     327
Applications     333
Introduction     333
High-Speed Servers     334
Core PDN Noise     336
I/O PDN Noise     345
Summary     349
High-Speed Differential Signaling     349
Test Vehicle Description     350
Plane Modeling     352
Modeling of Master and Slave Islands     358
Rational Function Modeling     361
Modal Decomposition and Noise Simulation     361
Summary     364
Analysis of IC Packages     365
Simulation of a Multilayered Package Using M-FDM     366
Causal Simulation of HyperBGA Package     368
Summary     372
Extraction of Dielectric Constant and Loss Tangent     372
Problem Definition     373
Corner-to-Corner Plane-Probing Method     378
Causal Model Development     386
Summary     391
Embedded Decoupling Capacitors     392
Embedded Individual Thin- or Thick-Film Capacitors     394
Why Embed Individual Capacitors     395
Design of an Embedded Thick-Film Capacitor Array      395
Integration of Embedded Capacitors into IBM Package     400
Embedded Planar Capacitors     404
Summary     415
Electromagnetic Bandgap (EBG) Structures     415
Basic Theory     416
Response of EBG Structures     417
Dispersion-Diagram Analysis     420
Modification of M-FDM Using Fringe and Gap Fields     424
Scalable Design of EBG Structures for Power Plane Isolation     430
Digital-RF Integration     434
ADC Load-Board Design     436
Issues with EBG Structures for Digital Systems     439
Summary     442
Future Challenges     443
Appendix A     451
Multiport Networks     451
Matrix Representation of Transmission Lines     453
Spectrum of Digital Signals     454
Software list     459
Index     461