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Chapter 1. Introduction Chapter 2. Manufacturing of 3-D Packaged Systems Chapter 3. 3-D Integrated Circuit Fabrication Technologies Chapter 4. Interconnect Prediction Models Chapter 5. Physical Design Techniques for 3-D ICs Chapter 6. Thermal Management Techniques Chapter 7. Timing Optimization for Two-Terminal Interconnects Chapter 8. Timing Optimization for Multi-Terminal Interconnects Appendix A: Enumeration of Gate Pairs in a 3-D IC Appendix B: Formal Proof of Optimum Single Via Placement Appendix C: Proof of the Two-Terminal Via Placement Heuristic Appendix D: Proof of Condition for Via Placement of Multi-Terminal Nets References
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Add Three-dimensional Integrated Circuit Design, With vastly increased complexity and functionality in the nanometer era (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. This is due primarily to the inevitable incr, Three-dimensional Integrated Circuit Design to the inventory that you are selling on WonderClubX
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Add Three-dimensional Integrated Circuit Design, With vastly increased complexity and functionality in the nanometer era (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. This is due primarily to the inevitable incr, Three-dimensional Integrated Circuit Design to your collection on WonderClub |