WIRE BONDING IN MICROELECTRONICS, 3/E Book

WIRE BONDING IN MICROELECTRONICS, 3/E, The Industry Standard Guide to Wire Bonding--Fully Updated The definitive resource on the critical process of connecting semiconductors with their packages. Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to h, WIRE BONDING IN MICROELECTRONICS, 3/E

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WIRE BONDING IN MICROELECTRONICS, 3/E
Written by author George Harman
Published by McGraw-Hill Companies,Inc., 1/20/2010
The Industry Standard Guide to Wire Bonding--Fully Updated The definitive resource on the critical process of connecting semiconductors with their packages. Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to h

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Introduction to Third Edition; Acknowledgments; Introduction to CD; Chapter 1. The Technical Introduction to the Third Edition; Chapter 2. Ultrasonic Bonding Systems and Technologies, Including a Description of the Ultrasonic Wire Bonding Mechanism; Chapter 3. Bonding Wire Metallurgy and Characteristics That Can Affect Bonding, Reliability, or Testing; Chapter 4. Wire Bond Testing; Chapter 5. Gold-Aluminum Intermetallic Compounds and Other Metallic Interface Reactions in Wire Bonding; Chapter 6. Introduction to Plating, Section A (Gold) and Section B (Nickel-Based) Bond Pad Technology and Reliability; Chapter 7. Cleaning to Improve Bondability and Reliability; Chapter 8. Mechanical Problems in Wire Bonding; Chapter 9. Advanced and Specialized Wire Bonding Technologies; Chapter 10. An Overview of the Materials and Material Science of Copper, Low-k Devices that Affect Bonding and Packaging; Chapter 11. Wire Bonding Process Modeling and Simulation; Glossary; Bibliography; Index

Title: WIRE BONDING IN MICROELECTRONICS, 3/E

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McGraw Hill

Item Number: 9780071642651

Number: 3

Product Description: WIRE BONDING IN MICROELECTRONICS, 3/E

Universal Product Code (UPC): 9780071642651

WonderClub Stock Keeping Unit (WSKU): 9780071642651

Rating: 4/5 based on 1 Reviews

Image Location: https://wonderclub.com/images/covers/26/51/9780071642651.jpg

Category: Media >> Books

Weight: 0.200 kg (0.44 lbs)

Width: 0.000 cm (0.00 inches)

Heigh : 0.000 cm (0.00 inches)

Depth: 0.000 cm (0.00 inches)

Date Added: August 25, 2020, Added By: Ross

Date Last Edited: August 25, 2020, Edited By: Ross

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WIRE BONDING IN MICROELECTRONICS, 3/E, The Industry Standard Guide to Wire Bonding--Fully Updated
The definitive resource on the critical process of connecting semiconductors with their packages. <i>Wire Bonding in Microelectronics</i>, Third Edition, has been thoroughly revised to h, WIRE BONDING IN MICROELECTRONICS, 3/E

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