MEMS/MOEM Packaging: Concepts, Designs, Materials and Processes Book

MEMS/MOEM Packaging: Concepts, Designs, Materials and Processes, While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of , MEMS/MOEM Packaging: Concepts, Designs, Materials and Processes

3 out of 5 stars based on 2 reviews

MEMS/MOEM Packaging: Concepts, Designs, Materials and Processes
Written by author Ken Gilleo
Published by McGraw-Hill Companies, The, July 2005
While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of
AUTHORITATIVE, COST-EFFECTIVE SOLUTIONS FOR MEMS AND MOEMS ASSEMBLIESThis is a rigorous examination of design concepts, fabrication processes, and properties of materials used in MEMS and MOEMS package construction and assembly, detailing routing, elec

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Ch. 1 Engineering fundamentals of MEMS and MOEMS electronic packaging 1
Ch. 2 Principles, materials, and fabrication of MEMS and MOEMS devices 29
Ch. 3 MEMS and MOEMS packaging challenges and strategies 65
Ch. 4 MEMS packaging processes 121
Ch. 5 MEMS packaging materials 159
Ch. 6 From MEMS and MOEMS to nanotechnology 183

Title: MEMS/MOEM Packaging: Concepts, Designs, Materials and Processes

Manufacturer:

McGraw Hill

Item Number: 9780071455565

Publication Date: July 2005

Number: 1

Product Description: Full Name: MEMS/MOEM Packaging: Concepts, Designs, Materials and Processes; Short Name:MEMS/MOEM Packaging

Universal Product Code (UPC): 9780071455565

WonderClub Stock Keeping Unit (WSKU): 9780071455565

Rating: 3/5 based on 2 Reviews

Image Location: https://wonderclub.com/images/covers/55/65/9780071455565.jpg

Category: Media >> Books

Weight: 0.200 kg (0.44 lbs)

Width: 6.200 cm (2.44 inches)

Heigh : 9.300 cm (3.66 inches)

Depth: 0.880 cm (0.35 inches)

Date Added: August 25, 2020, Added By: Ross

Date Last Edited: August 25, 2020, Edited By: Ross

Price	Condition	Delivery	Seller	Action
$134.27	Digital	Arrives between Apr 27 - May 27 Login to your account for a direct download. Some files are emailed from Dropbox. Continent $0.00 - World $0.00	WonderClub (9294 total ratings)

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Kevin Murphy

reviewed MEMS/MOEM Packaging: Concepts, Designs, Materials and Processes on October 18, 2013

MEMS/MOEM Packaging: Concepts, Designs, Materials and Processes

This is a collection of essays written for popular science magazines and compiled into a book which neither informs nor entertains. Though dated, the wild promises it makes in regards to nanotech for the near future (i.e., 5 years ago) don't seem very exciting in retrospect. Atkinson's book makes nanotech look like the cold fusion of the 2000s.

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MEMS/MOEM Packaging: Concepts, Designs, Materials and Processes, While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of , MEMS/MOEM Packaging: Concepts, Designs, Materials and Processes

Add MEMS/MOEM Packaging: Concepts, Designs, Materials and Processes, While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of , MEMS/MOEM Packaging: Concepts, Designs, Materials and Processes to the inventory that you are selling on WonderClub

Add MEMS/MOEM Packaging: Concepts, Designs, Materials and Processes, While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of , MEMS/MOEM Packaging: Concepts, Designs, Materials and Processes to your collection on WonderClub

MEMS/MOEM Packaging: Concepts, Designs, Materials and Processes Book

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Ch. 1	Engineering fundamentals of MEMS and MOEMS electronic packaging	1
Ch. 2	Principles, materials, and fabrication of MEMS and MOEMS devices	29
Ch. 3	MEMS and MOEMS packaging challenges and strategies	65
Ch. 4	MEMS packaging processes	121
Ch. 5	MEMS packaging materials	159
Ch. 6	From MEMS and MOEMS to nanotechnology	183