Ultraclean Surface Processing of Silicon Wafers: Secrects of VLSI Manufacturing Book

1	Ultraclean Technology for VLSI Manufacturing: An Overview	3
2	Influence of Silicon Crystal Quality on Device Characteristics	21
3	Influence of Contaminants on Device Characteristics	29
4	Influence of Metallic Contamination on Dielectric Degradation of MOS Structures	42
5	Influence of Micro-Roughness on Device Characteristics	57
6	Particle Deposition in Air	67
7	Particle Deposition in Plasma	82
8	Particle Deposition in Vacuum	92
9	Particle Adhesion in Liquids	105
10	Particle Adhesion and Removal on Wafer Surfaces in RCA Cleaning	115
11	Effects of Electrostatic Charge on Particle Adhesion on Wafer Surfaces	137
12	Measurement of Particles on Wafer Surfaces	153
13	Analysis and Evaluation of Impurities of Wafer Surfaces	168
14	Analysis and Evaluation of Molecules Adhered to Wafer Surfaces	179
15	Electrical Evaluation of Metallic Impurities on Wafer Surfaces	194
16	Analysis of Microscopic Areas on Wafer Surfaces Using STM/AFM	223
17	Detection and Analysis of Particles in Production Lines	243
18	Pattern Defect Monitoring in Production Lines	259
19	Clean Level Monitoring in Production Lines	271
20	Analysis of Defects in Devices and Silicon Crystals in Production Lines	286
21	Oxidation and Diffusion	305
22	CVD (Part 1): Atmospheric Pressure/Low-Pressure CVD	317
23	CVD (Part 2): Plasma CVD	331
24	CVD (Part 3): Metal CVD	342
25	Physical Vapor Deposition	352
26	Dry Etching (Part 1): Particulate Contamination Due to Dry Etching	361
27	Dry Etching (Part 2): Influence of Chemical Contamination and Defects on Dry Etching	371
28	Ion Implantation	384
29	Lithography	398
30	CMP	414
31	Cluster Tools	426
32	Trends in Wafer Cleaning Technology	437
33	Wet Cleaning (Part 1): Removal of Particulate Contaminants	451
34	Wet Cleaning (Part 2): Removal of Metallic Contaminants	462
35	Wet Cleaning (Part 3): Removal of Organic Contaminants	474
36	Wet Cleaning (Part 4): Micro-Roughness and COPs Created by SC-1	482
37	Wafer Drying After Wet Cleaning	494
38	Watermarks: Generation, Control, and Removal	503
39	Physical Cleaning	508
40	Dry Cleaning	514
41	HF Vapor Cleaning Technology	531
42	Native Oxide Films and Chemical Oxide Films	543
43	Hydrogen Termination: The Ideally Finished Silicon Surface	559
44	Adsorption of Organic Volatiles on Silicon Surfaces and Their Removal by Wet Cleaning	566
45	Wafer Carrier Cleaning	584
46	Goals for Next-Generation Wafer Cleaning Technology	594
	Index	609