Wonder Club world wonders pyramid logo
×

Optoelectronic Interconnects II: Photonics Packaging and Integration Book

Optoelectronic Interconnects II: Photonics Packaging and Integration
Be the First to Review this Item at Wonderclub
X
Optoelectronic Interconnects II: Photonics Packaging and Integration, , Optoelectronic Interconnects II: Photonics Packaging and Integration
out of 5 stars based on 0 reviews
5
0 %
4
0 %
3
0 %
2
0 %
1
0 %
Digital Copy
PDF format
1 available   for $233.82
Original Magazine
Physical Format

Sold Out

  • Optoelectronic Interconnects II: Photonics Packaging and Integration
  • Written by author Michael R. Feldman, Richard L. Li, W. Brian Matkin, Suning Tang
  • Published by SPIE Press, 4/28/2000
Buy Digital  USD$233.82

WonderClub View Cart Button

WonderClub Add to Inventory Button
WonderClub Add to Wishlist Button
WonderClub Add to Collection Button

Book Categories

Authors


Login

  |  

Complaints

  |  

Blog

  |  

Games

  |  

Digital Media

  |  

Souls

  |  

Obituary

  |  

Contact Us

  |  

FAQ

CAN'T FIND WHAT YOU'RE LOOKING FOR? CLICK HERE!!!

X
WonderClub Home

This item is in your Wish List

Optoelectronic Interconnects II: Photonics Packaging and Integration, , Optoelectronic Interconnects II: Photonics Packaging and Integration

X
WonderClub Home

This item is in your Collection

Optoelectronic Interconnects II: Photonics Packaging and Integration, , Optoelectronic Interconnects II: Photonics Packaging and Integration

Optoelectronic Interconnects II: Photonics Packaging and Integration

X
WonderClub Home

This Item is in Your Inventory

Optoelectronic Interconnects II: Photonics Packaging and Integration, , Optoelectronic Interconnects II: Photonics Packaging and Integration

Optoelectronic Interconnects II: Photonics Packaging and Integration

WonderClub Home

You must be logged in to review the products

E-mail address:

Password: