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Preface | ||
1 | Overview of Lead-Free Solder Issues Including Selection | 1 |
2 | Health and Environmental Effects of Lead and Other Commonly Used Elements in Microelectronics | 49 |
3 | Environmental Impact of Lead and Alternatives in Electronics | 83 |
4 | Environmental Stewardship with Regional Perspectives and Drives of the Lead-Free Issue | 115 |
5 | Market, Product, and Corporate Policy Trends | 149 |
6 | The Metallurgical Aspects, Properties, and Applications of Solders from the Lead-Tin System | 167 |
7 | Physical Basis for Mechanical Properties of Solders | 211 |
8 | Sn-Ag and Sn-Ag-X Solders and Properties | 239 |
9 | Bi-Sn, Sn-Sb, Sn-Cu, Sn-Zn, and Sn-In Solder-Based Systems and Their Properties | 281 |
10 | High-Temperature Lead-Free Solders with Dispersoids | 301 |
11 | Solder Wetting and Spreading | 331 |
12 | Lead-Free Finishes for Printed Circuit Boards and Components | 431 |
13 | Formation of Intermetallic Compounds at Pb-Sn/Metal and Lead-Free/Metal Interfaces in Solder Joints | 465 |
14 | Electronics Assembly and the Impact of Lead-Free Materials | 495 |
15 | Use of Inert Atmospheres in Lead-Free Soldering | 569 |
16 | Pb-Free Component Conversion and Some Manufacturing Experiences | 591 |
17 | Major International Lead (Pb)-Free Solder Studies | 665 |
18 | Electrically Conductive Adhesives - A Lead-Free Alternative | 729 |
19 | Reliability Aspects of Lead-Free Solders in Electronic Assemblies | 769 |
20 | The Physics and Materials Science of Electromigration and Thermomigration in Solders | 827 |
21 | The Structure and Kinetics of Tin-Whisker Formation and Growth on High Tin Content Finishes | 851 |
22 | Degradation Phenomena | 915 |
Index | 979 | |
Biographies | 1015 |
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Add Handbook Of Lead-Free Solder Technology For Microelectronic Assemblies, With lead-free solder becoming prevalent, this book covers issues that are specific to these new alloys, examining the use of lead-free solder in a number of microelectronic applications, and looking at costs, health and legal issues and more., Handbook Of Lead-Free Solder Technology For Microelectronic Assemblies to the inventory that you are selling on WonderClubX
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Add Handbook Of Lead-Free Solder Technology For Microelectronic Assemblies, With lead-free solder becoming prevalent, this book covers issues that are specific to these new alloys, examining the use of lead-free solder in a number of microelectronic applications, and looking at costs, health and legal issues and more., Handbook Of Lead-Free Solder Technology For Microelectronic Assemblies to your collection on WonderClub |