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Book Categories |
Preface | ||
List of Commands | ||
List of Tables | ||
List of Figures | ||
1 | Introduction | 1 |
2 | Thermomechanical Fatigue Life Prediction Analysis | 17 |
3 | Mechanical Bending Fatigue Life Prediction Analysis | 69 |
4 | Macro Reference Library | 87 |
App. A | Installation and Execution | 163 |
App. B | Input Listings for Case Studies | 175 |
Index | 183 |
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Add Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS, Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigu, Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS to the inventory that you are selling on WonderClubX
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Add Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS, Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigu, Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS to your collection on WonderClub |