Stress Induced Phenomena in Metallization : 5th International Workshop, Stuttgart, Germany, June 23-25, 1999 Book

	Preface
	Electromigration Early Failure Distribution in Submicron Interconnects	3
	Direct Measurement of Nucleation Times and Growth Rates of Electromigration Induced Voids	15
	Electromigration in Aluminum Damascene Lines	27
	Reliability Considerations for Copper Metallizations in ULSI Circuits	39
	Electromigration Modeling for Design Rule Development in Microelectronic Interconnects	51
	Modeling and Experimental Characterization of Electromigration in Interconnect Trees	62
	Diffusion-Induced Stresses	77
	In Situ Study of Interconnect Failures by Electromigration Inside a Scanning Electron Microscope	89
	Model Studies of Electromigration Using Indented Single-Crystal Aluminum Lines	100
	Local Strain Measurements during Electromigration	112
	Alloying Effects in Electromigration: What Controls the Electromigration Drift?	126
	Multiprobe Resistance Monitoring of Blech Pattern during Electromigration Testing	138
	3-D Finite Element Simulator for Migration Effects due to Various Driving Forces in Interconnect Lines	150
	In Situ Electromigration Damage in Al Interconnect Lines in the SEM and the Influence of Grain Orientation	162
	Effect of Grain Boundary/Interface Network on Cavity Growth under Interacted Migration Induced by Stress and Electric Current	168
	Stress-Induced and Electromigration Voiding in Nitride Passivated Al Interconnects	174
	In-Situ Studies of Electromigration Voiding in Passivated Copper Interconnects	180
	Molecular Dynamic Simulation of Grain Boundary Diffusivities and Vacancy Behavior in Al	186
	Nucleation, Growth, Interduffusion, and Adhesion of Metal Films on Polymers	201
	Thermoclastic Analysis of Thin Lines on Substrates	217
	Mechanical Strains and Stresses in Aluminum and Copper Interconnect Lines for 0.18 [mu]m Logic Technologies	229
	Anelastic Contributions to the Behavior of Freestanding Al Thin Films	240
	Stress in Electrochemically Deposited Copper	249
	Microstructural Analysis of Al Interconnects in Microprocessor Devices Using EFTEM	255
	Quantitative Texture Analysis of Cu Damascene Interconnects	261
	Stress Relaxation and Creep in Freestanding Thin Al Films Studied Using a Bulge Tester	265
	Grain Growth and Twinning in Copper Thin Films for ULSI Circuits	271
	Stress and Plasticity in Passivated Interconnect Lines	277
	Stress and Plasticity in Cu Thin Films	283
	Analysis of Local Strain in Aluminum Interconnects by Convergent Beam Electron Diffraction	289
	A Finite Element Study of Thermal Stress in Copper Interconnect	298
	Thermal Stresses in Cu and Damascene Submicron Line Structures	304
	Subject Index	315
	Author Index	317