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Overview: Electronic Manufacturing and the IC.- Integrated Circuit Manufacturing - A Technology Resource.- Packaging the IC.- The Chip Scale Package.- Multichip Packaging.- Known Good Die.- Chip On Board.- Chip & Wire Assembly.- Flip Chip - The Bumping Processes.- Flip Chip Assembly.- Tape Automated Bonding – TAB.- HDI Substrate Manufacturing –The Thin Film Process.- HDI Substrate Manufacturing - The Thick Film Process.- HDI Substrate Manufacturing – The Cofired Ceramic Tape Process.- HDI Manufacture - The Printed Wiring Board (PWB), The Laminate Multichip Module (MCM-L), The HDI PWB.
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| $132.65 | Digital |
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Add Integrated Circuit Packaging, Assembly and Interconnections, Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It co, Integrated Circuit Packaging, Assembly and Interconnections to the inventory that you are selling on WonderClubX
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Add Integrated Circuit Packaging, Assembly and Interconnections, Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It co, Integrated Circuit Packaging, Assembly and Interconnections to your collection on WonderClub |