Titanium Nickel Silver & Gold Die Backside Metalization for Quad Flat Nolead Package Thermal Resistance Reduction. Book

Name: Titanium Nickel Silver & Gold Die Backside Metalization for Q
Brand: WonderClub
SKU: 9781244594432
Price: 99.99 USD
Availability: InStock
Rating: 4 (1 reviews)

Titanium Nickel Silver & Gold Die Backside Metalization for Quad Flat Nolead Package Thermal Resistance Reduction., , Titanium Nickel Silver and Gold Die Backside Metalization for Quad Flat Nolead Package Thermal Resistance Reduction.

out of 5 stars based on 0 reviews

Titanium Nickel Silver and Gold Die Backside Metalization for Quad Flat Nolead Package Thermal Resistance Reduction.
Written by author Hung Chau
Published by , September 2011

Buy Digital USD$99.99

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Title: Titanium Nickel Silver & Gold Die Backside Metalization for Quad Flat Nolead Package Thermal Resistance Reduction.

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WonderClub

Item Number: 9781244594432

Number: 1

Product Description: Full Name: Titanium Nickel Silver & Gold Die Backside Metalization for Quad Flat Nolead Package Thermal Resistance Reduction.; Short Name:Titanium Nickel Silver & Gold Die Backside Metalization for Quad Flat Nolead Package Thermal Resista

Universal Product Code (UPC): 9781244594432

WonderClub Stock Keeping Unit (WSKU): 9781244594432

Rating: 4/5 based on 1 Reviews

Image Location: https://wonderclub.com/images/covers/44/32/9781244594432.jpg

Category: Media >> Books

Weight: 0.200 kg (0.44 lbs)

Width: 0.000 cm (0.00 inches)

Heigh : 0.000 cm (0.00 inches)

Depth: 0.000 cm (0.00 inches)

Date Added: August 25, 2020, Added By: Ross

Date Last Edited: August 25, 2020, Edited By: Ross

Price	Condition	Delivery	Seller	Action
$99.99	Digital	Arrives between Apr 26 - May 26 Login to your account for a direct download. Some files are emailed from Dropbox. Continent $0.00 - World $0.00	WonderClub (9294 total ratings)

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Titanium Nickel Silver & Gold Die Backside Metalization for Quad Flat Nolead Package Thermal Resistance Reduction., , Titanium Nickel Silver and Gold Die Backside Metalization for Quad Flat Nolead Package Thermal Resistance Reduction.

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