Quality Inspection and Reliability Study of Solder Bumps in Packaged Electronic Devices Book

Name: Quality Inspection and Reliability Study of Solder Bumps in Packa
Brand: WonderClub
SKU: 9781243589705
Price: 99.99 USD
Availability: InStock
Rating: 4 (1 reviews)

Quality Inspection and Reliability Study of Solder Bumps in Packaged Electronic Devices, , Quality Inspection and Reliability Study of Solder Bumps in Packaged Electronic Devices

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Quality Inspection and Reliability Study of Solder Bumps in Packaged Electronic Devices
Written by author Jin Yang
Published by , September 2011

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Title: Quality Inspection and Reliability Study of Solder Bumps in Packaged Electronic Devices

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WonderClub

Item Number: 9781243589705

Number: 1

Product Description: Quality Inspection and Reliability Study of Solder Bumps in Packaged Electronic Devices

Universal Product Code (UPC): 9781243589705

WonderClub Stock Keeping Unit (WSKU): 9781243589705

Rating: 4/5 based on 1 Reviews

Image Location: https://wonderclub.com/images/covers/97/05/9781243589705.jpg

Category: Media >> Books

Weight: 0.200 kg (0.44 lbs)

Width: 0.000 cm (0.00 inches)

Heigh : 0.000 cm (0.00 inches)

Depth: 0.000 cm (0.00 inches)

Date Added: August 25, 2020, Added By: Ross

Date Last Edited: August 25, 2020, Edited By: Ross

Price	Condition	Delivery	Seller	Action
$99.99	Digital	Arrives between May 12 - Jun 11 Login to your account for a direct download. Some files are emailed from Dropbox. Continent $0.00 - World $0.00	WonderClub (9296 total ratings)

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