Handbook of Electronic Packaging Design Book

"Introduction, Michael D. Osterman and Michael Pecht Electronic Components, Denise BurkusHarris, Michael Pecht, and Pradeep Lall Printed Wiring Board Design and Fabrication, Denise Burkus Harris and Pradeep Lall Electronic Assemblies, Denise Burkus Harris Interconnections and Connectors, Pradeep Lall and Michael Pecht Layout, Michael D. Osterman and Michael Pecht Thermal Design Analysis, Dennis K. Karr, David Dancer, and Milton Palmes, III Thermomechanical Analysis and Design, Abhijit Dasgupta Vibration and Shock Analysis and Design, Donald B. Barker Humidity and Corrosion Analysis and Design, Wing C. Ko and Michael Pecht Design for Reliability, Michael Pecht Electronic Materials and Properties, Jillian Y. Evans and John W. Evans Appendix A: Acronyms Used in Electronics Appendix B: Glossary of Hybrid Microcircuits Packaging Terms Appendix C: Standards and Specifications for Microelectronics Appendix D: Standards and Specifications for PCBs and PWBs Appendix E: Unit Conversion Tables "