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Book Categories |
1. | Introduction | 1 |
Acknowledgments | 3 | |
2. | Interconnect Issues | 5 |
2.1 | Overview | 5 |
2.2 | Materials requirements | 10 |
2.3 | Materials options | 13 |
2.4 | Multilevel interconnect fabrication | 14 |
3. | Copper Deposition | 19 |
3.1 | Overview | 19 |
3.2 | Chemical deposition methods for copper | 19 |
3.2.1 | Chemical vapor deposition (CVD) | 20 |
3.2.2 | Electrochemical plating (ECP) | 24 |
3.3 | Physical deposition methods for copper | 28 |
3.3.1 | Collimated and long-throw sputter deposition | 29 |
3.3.2 | Ionized physical vapor deposition (IPVD) | 31 |
4. | Copper Patterning | 35 |
4.1 | Overview | 35 |
4.2 | Subtractive copper patterning | 35 |
4.2.1 | Reactive ion etching of copper | 36 |
4.2.2 | Etching of copper in high-density plasmas (MIE, ECR, ICP) | 38 |
4.2.3 | Radiation-enhanced RIE of copper | 40 |
4.3 | Additive copper patterning by chemical-mechanical polishing (CMP) | 41 |
5. | Interlayer Dielectrics | 47 |
5.1 | Silicate-based ILDs | 49 |
5.1.1 | Undoped Si oxides | 49 |
5.1.2 | Doped Si oxides | 51 |
5.2 | Organic polymer-based ILDs | 58 |
5.2.1 | Non-fluorinated organic polymers | 58 |
5.2.2 | Fluorinated organic polymers | 60 |
5.3 | Patterning of ILDs | 63 |
5.3.1 | Overview | 63 |
5.3.2 | Patterning of silicate-based ILDs | 64 |
5.3.3 | Patterning of organic polymeric ILDs | 66 |
5.3.4 | Etching dual-damascene structures into the ILD | 68 |
5.3.5 | Via cleaning | 71 |
5.3.6 | Planarization of low-k ILDs by CMP | 72 |
6. | Cu/ILD Barriers | 75 |
6.1 | Cu/undoped-SiO[subscript 2] barriers | 78 |
6.2 | Cu/doped-SiO[subscript 2] barriers | 79 |
6.3 | Cu/polymer barriers | 80 |
7. | Current Practice | 83 |
7.1 | Overview | 83 |
7.2 | Preclean | 83 |
7.3 | Barrier layers | 86 |
7.4 | Copper fill methods | 92 |
7.5 | Future directions | 98 |
References | 103 | |
Index | 119 |
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Add Copper Interconnect Technology, Copper interconnect technology is expected to be a key component in the quest to create more powerful CPUs and memory chips. This text examines the role of copper in future interconnects, presents the range of problems involved, and explains how the solut, Copper Interconnect Technology to the inventory that you are selling on WonderClubX
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Add Copper Interconnect Technology, Copper interconnect technology is expected to be a key component in the quest to create more powerful CPUs and memory chips. This text examines the role of copper in future interconnects, presents the range of problems involved, and explains how the solut, Copper Interconnect Technology to your collection on WonderClub |