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Copper Interconnect Technology Book

Copper Interconnect Technology
Copper Interconnect Technology, Copper interconnect technology is expected to be a key component in the quest to create more powerful CPUs and memory chips. This text examines the role of copper in future interconnects, presents the range of problems involved, and explains how the solut, Copper Interconnect Technology has a rating of 3 stars
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Copper Interconnect Technology, Copper interconnect technology is expected to be a key component in the quest to create more powerful CPUs and memory chips. This text examines the role of copper in future interconnects, presents the range of problems involved, and explains how the solut, Copper Interconnect Technology
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  • Copper Interconnect Technology
  • Written by author Barry Chin
  • Published by SPIE Society of Photo-Optical Instrumentation Engi, 2000/10/31
  • Copper interconnect technology is expected to be a key component in the quest to create more powerful CPUs and memory chips. This text examines the role of copper in future interconnects, presents the range of problems involved, and explains how the solut
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1. Introduction 1
Acknowledgments 3
2. Interconnect Issues 5
2.1 Overview 5
2.2 Materials requirements 10
2.3 Materials options 13
2.4 Multilevel interconnect fabrication 14
3. Copper Deposition 19
3.1 Overview 19
3.2 Chemical deposition methods for copper 19
3.2.1 Chemical vapor deposition (CVD) 20
3.2.2 Electrochemical plating (ECP) 24
3.3 Physical deposition methods for copper 28
3.3.1 Collimated and long-throw sputter deposition 29
3.3.2 Ionized physical vapor deposition (IPVD) 31
4. Copper Patterning 35
4.1 Overview 35
4.2 Subtractive copper patterning 35
4.2.1 Reactive ion etching of copper 36
4.2.2 Etching of copper in high-density plasmas (MIE, ECR, ICP) 38
4.2.3 Radiation-enhanced RIE of copper 40
4.3 Additive copper patterning by chemical-mechanical polishing (CMP) 41
5. Interlayer Dielectrics 47
5.1 Silicate-based ILDs 49
5.1.1 Undoped Si oxides 49
5.1.2 Doped Si oxides 51
5.2 Organic polymer-based ILDs 58
5.2.1 Non-fluorinated organic polymers 58
5.2.2 Fluorinated organic polymers 60
5.3 Patterning of ILDs 63
5.3.1 Overview 63
5.3.2 Patterning of silicate-based ILDs 64
5.3.3 Patterning of organic polymeric ILDs 66
5.3.4 Etching dual-damascene structures into the ILD 68
5.3.5 Via cleaning 71
5.3.6 Planarization of low-k ILDs by CMP 72
6. Cu/ILD Barriers 75
6.1 Cu/undoped-SiO[subscript 2] barriers 78
6.2 Cu/doped-SiO[subscript 2] barriers 79
6.3 Cu/polymer barriers 80
7. Current Practice 83
7.1 Overview 83
7.2 Preclean 83
7.3 Barrier layers 86
7.4 Copper fill methods 92
7.5 Future directions 98
References 103
Index 119


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Copper Interconnect Technology, Copper interconnect technology is expected to be a key component in the quest to create more powerful CPUs and memory chips. This text examines the role of copper in future interconnects, presents the range of problems involved, and explains how the solut, Copper Interconnect Technology

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Copper Interconnect Technology, Copper interconnect technology is expected to be a key component in the quest to create more powerful CPUs and memory chips. This text examines the role of copper in future interconnects, presents the range of problems involved, and explains how the solut, Copper Interconnect Technology

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