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Book Categories |
| Preface | ||
| Ch. 1 | Introduction of Electronic Packaging | 1 |
| Ch. 2 | Trends/Drivers in the Electronics Manufacturing Industry | 21 |
| Ch. 3 | Area Array Packaging | 47 |
| Ch. 4 | Stacked/3D Packages | 61 |
| Ch. 5 | Compliant IC Packaging | 81 |
| Ch. 6 | Flip Chip Technology | 103 |
| Ch. 7 | Options in High-Density Part Cleaning | 141 |
| Ch. 8 | MEMS Packaging and Assembly Challenges | 149 |
| Ch. 9 | Ceramic Ball and Column Grid Array Overview | 169 |
| Index | 195 |
| Price | Condition | Delivery | Seller | Action |
| $99.99 | Digital |
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Add Area Array Package Design, This comprehensive tutorial on area array package design features the most important new techniques, clearly explained by a team of world-class professionals and researchers. Area Array Package Design provides hands-on expertise and leading-edge in, Area Array Package Design to the inventory that you are selling on WonderClubX
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Add Area Array Package Design, This comprehensive tutorial on area array package design features the most important new techniques, clearly explained by a team of world-class professionals and researchers. Area Array Package Design provides hands-on expertise and leading-edge in, Area Array Package Design to your collection on WonderClub |