Materials Developments in Microelectronic Packaging: Performance & Reliability Proceedings of the Fourth Electronic Materials & Processing Con Book

Name: Materials Developments in Microelectronic Packaging: Performance
Brand: WonderClub
SKU: 9780871704351
Price: 99.99 USD
Availability: InStock
Rating: 4 (1 reviews)

Materials Developments in Microelectronic Packaging: Performance & Reliability Proceedings of the Fourth Electronic Materials & Processing Con, , Materials Developments in Microelectronic Packaging: Performance and Reliability Proceedings of the Fourth Electronic Materials and Processing Con

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Materials Developments in Microelectronic Packaging: Performance and Reliability Proceedings of the Fourth Electronic Materials and Processing Con
Written by author Prabjit Singh
Published by ASM International, 1991/12/01

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Title: Materials Developments in Microelectronic Packaging: Performance & Reliability Proceedings of the Fourth Electronic Materials & Processing Con

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Item Number: 9780871704351

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Product Description: Full Name: Materials Developments in Microelectronic Packaging: Performance & Reliability Proceedings of the Fourth Electronic Materials & Processing Con; Short Name:Materials Developments in Microelectronic Packaging

Universal Product Code (UPC): 9780871704351

WonderClub Stock Keeping Unit (WSKU): 9780871704351

Rating: 4/5 based on 1 Reviews

Image Location: https://wonderclub.com/images/covers/43/51/9780871704351.jpg

Category: Media >> Books

Weight: 0.200 kg (0.44 lbs)

Width: 0.000 cm (0.00 inches)

Heigh : 0.000 cm (0.00 inches)

Depth: 0.000 cm (0.00 inches)

Date Added: August 25, 2020, Added By: Ross

Date Last Edited: August 25, 2020, Edited By: Ross

Price	Condition	Delivery	Seller	Action
$99.99	Digital	Arrives between Apr 16 - May 16 Login to your account for a direct download. Some files are emailed from Dropbox. Continent $0.00 - World $0.00	WonderClub (9292 total ratings)

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