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Electronic Packaging: Materials & Processes to Reduce Package Cycle Time & Improve Reliability Proceedings of the 7th Electronic Meterials and Book

Electronic Packaging: Materials & Processes to Reduce Package Cycle Time & Improve Reliability  Proceedings of the 7th Electronic Meterials and
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Electronic Packaging: Materials & Processes to Reduce Package Cycle Time & Improve Reliability Proceedings of the 7th Electronic Meterials and, , Electronic Packaging: Materials and Processes to Reduce Package Cycle Time and Improve Reliability Proceedings of the 7th Electronic Meterials and
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  • Electronic Packaging: Materials and Processes to Reduce Package Cycle Time and Improve Reliability Proceedings of the 7th Electronic Meterials and
  • Written by author Colin MacKay
  • Published by ASM International, 1992/12/01
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Materials for Electronics and Photonics Packaging 1
Sess. 1 Multi-Chip Modules I
Electrical Characterization of a Multilayer Low Temperature Co-Fireable Ceramic Multi-chip Module 11
Repairable Die-Attach for Multi-Chip Modules 19
Sess. 2 Surface Analysis and Characterization I
Analysis and Characterization of Interfacial Failures 23
Surface Characterization of Plasma-Oxidized Hg[subscript 1-x]Cd[subscript x]Te 31
The Multitechnique Approach to Characterization of Materials Problems in Electronic and Microelectronic Systems 37
Failure Analysis and Elimination of Ion Migration on a Printed Circuit Board 45
Failure Analysis of Die Bond Adhesion Failures Caused by Silicone Contamination 55
Sess. 3 Surface Analysis and Characterization II
Corrosion Prevention in a Hydrogen Chloride Gas Distribution System 65
Semiconductor Materials and Process Characterization by High Resolution Auger Electron Spectroscopy 71
Contact Resistance Failures on CrSi Thin Film Resistors 77
Sess. 4 Microelectronics Interconnections I
Rebonding: Bond on Bond Rework for Aluminum Ultrasonic Wire Bonding 83
Characterization of Ultrasonic Wire Bonded Substrates 89
Process Characterization and Reliability of Solid State Wire and Tape Bonds 97
Fluxless TAB Outer Lead Bonding with a Laser 101
A Comparative Finite Element and Experimental Study of Retention Forces in Two Needle-Eye Pin/Through Hole Connections 107
Sess. 5 Multi-chip Modules II
Excimer vs NdYAG Laser Creation of Silicon Vias for 3D Interconnects 115
Laser Writing to Customize Multi-Chip Module Substrates 121
Commercial Copper Polyimide Dielectric MCM Substrate: A TEM Study 127
Liquid Metal Pastes for Thermal Connections 133
Sess. 6 Surface Mount Technology and PCBs I
Amalgams for Electronics Interconnect 141
Solder/Polymer Composite Paste for Surface Mount Technology 149
Dry Surface Cleaning Using Carbon Dioxide Snow 155
Compression Bonder for Flip Chip Assembly of High I/O Die 161
Sess. 8 Optoelectronic Packaging
Fiber Optic Duplex Connector Design Evolution and Analysis 169
Metal Coating of Optical Fibers 177
Optical Interconnection Adaptation for Emerging MCM Environments 185
Measurements of the Refractive Index and Birefringence of Polyimide Thin Film Dielectrics as a Function of Relative Humidity and Temperature 197
Time Domain Measurements, Modeling, and High Frequency Analysis of MIMIC Packages 203
Sess. 9 Surface Mount Technology and PCBs II
Effect of Sn Content on Crack Growth Rate in Low-Cycle Fatigue of Pb-Sn Solder Joints 209
Cyclic Deformation and Mechanical Fatigue of Indium Solder Joints 217
Sess. 10 Microelectronics Interconnections II
Microstructure, Interfacial Reactions, and Mechanical Properties of 70/30 Sn/Pb C4 Interconnections: Part I - Microstructure and Interfacial Reactions 225
Material and Design Considerations of Flexible Signal Connectors for the VAX 9000 MCU 231
Wideband Characterization of Low-Loss Dielectric Materials for Electronic Packaging Applications 239
Sess. 11 Microelectronics Interconnections III
Maskless Selective Gold Plating to Improve Bonding to AlGaAs Based Devices 245
Sess. 12 Polymeric Adhesives for Low-Cost Packaging Applications
Effective Polymer Adhesives for Interconnect 249
Use of Conductive Plastic in Electronic Packaging 257


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