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Keynote | ||
Materials for Electronics and Photonics Packaging | 1 | |
Sess. 1 | Multi-Chip Modules I | |
Electrical Characterization of a Multilayer Low Temperature Co-Fireable Ceramic Multi-chip Module | 11 | |
Repairable Die-Attach for Multi-Chip Modules | 19 | |
Sess. 2 | Surface Analysis and Characterization I | |
Analysis and Characterization of Interfacial Failures | 23 | |
Surface Characterization of Plasma-Oxidized Hg[subscript 1-x]Cd[subscript x]Te | 31 | |
The Multitechnique Approach to Characterization of Materials Problems in Electronic and Microelectronic Systems | 37 | |
Failure Analysis and Elimination of Ion Migration on a Printed Circuit Board | 45 | |
Failure Analysis of Die Bond Adhesion Failures Caused by Silicone Contamination | 55 | |
Sess. 3 | Surface Analysis and Characterization II | |
Corrosion Prevention in a Hydrogen Chloride Gas Distribution System | 65 | |
Semiconductor Materials and Process Characterization by High Resolution Auger Electron Spectroscopy | 71 | |
Contact Resistance Failures on CrSi Thin Film Resistors | 77 | |
Sess. 4 | Microelectronics Interconnections I | |
Rebonding: Bond on Bond Rework for Aluminum Ultrasonic Wire Bonding | 83 | |
Characterization of Ultrasonic Wire Bonded Substrates | 89 | |
Process Characterization and Reliability of Solid State Wire and Tape Bonds | 97 | |
Fluxless TAB Outer Lead Bonding with a Laser | 101 | |
A Comparative Finite Element and Experimental Study of Retention Forces in Two Needle-Eye Pin/Through Hole Connections | 107 | |
Sess. 5 | Multi-chip Modules II | |
Excimer vs NdYAG Laser Creation of Silicon Vias for 3D Interconnects | 115 | |
Laser Writing to Customize Multi-Chip Module Substrates | 121 | |
Commercial Copper Polyimide Dielectric MCM Substrate: A TEM Study | 127 | |
Liquid Metal Pastes for Thermal Connections | 133 | |
Sess. 6 | Surface Mount Technology and PCBs I | |
Amalgams for Electronics Interconnect | 141 | |
Solder/Polymer Composite Paste for Surface Mount Technology | 149 | |
Dry Surface Cleaning Using Carbon Dioxide Snow | 155 | |
Compression Bonder for Flip Chip Assembly of High I/O Die | 161 | |
Sess. 8 | Optoelectronic Packaging | |
Fiber Optic Duplex Connector Design Evolution and Analysis | 169 | |
Metal Coating of Optical Fibers | 177 | |
Optical Interconnection Adaptation for Emerging MCM Environments | 185 | |
Measurements of the Refractive Index and Birefringence of Polyimide Thin Film Dielectrics as a Function of Relative Humidity and Temperature | 197 | |
Time Domain Measurements, Modeling, and High Frequency Analysis of MIMIC Packages | 203 | |
Sess. 9 | Surface Mount Technology and PCBs II | |
Effect of Sn Content on Crack Growth Rate in Low-Cycle Fatigue of Pb-Sn Solder Joints | 209 | |
Cyclic Deformation and Mechanical Fatigue of Indium Solder Joints | 217 | |
Sess. 10 | Microelectronics Interconnections II | |
Microstructure, Interfacial Reactions, and Mechanical Properties of 70/30 Sn/Pb C4 Interconnections: Part I - Microstructure and Interfacial Reactions | 225 | |
Material and Design Considerations of Flexible Signal Connectors for the VAX 9000 MCU | 231 | |
Wideband Characterization of Low-Loss Dielectric Materials for Electronic Packaging Applications | 239 | |
Sess. 11 | Microelectronics Interconnections III | |
Maskless Selective Gold Plating to Improve Bonding to AlGaAs Based Devices | 245 | |
Sess. 12 | Polymeric Adhesives for Low-Cost Packaging Applications | |
Effective Polymer Adhesives for Interconnect | 249 | |
Use of Conductive Plastic in Electronic Packaging | 257 |
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