Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication:: From Particle Scale to Feature, Die & Wafer Scales Book

Name: Integrated Modeling of Chemical Mechanical Planarization for Sub-
Brand: Steidl Publishing
SKU: 9783642061158
Price: 200.64 USD
Availability: InStock
Rating: 4 (1 reviews)

Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication:: From Particle Scale to Feature, Die & Wafer Scales, This book is the product of a developing research focus on CMP at Berkeley. Its focus is on the important area of process models which have not kept pace with the tremendous expansion of applications of CMP. It specifically deals with the development of m, Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication:: From Particle Scale to Feature, Die and Wafer Scales

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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication:: From Particle Scale to Feature, Die and Wafer Scales
Written by author Luo, Jianfeng, Dornfeld, David
Published by Springer-Verlag New York, LLC, 12/1/2010
This book is the product of a developing research focus on CMP at Berkeley. Its focus is on the important area of process models which have not kept pace with the tremendous expansion of applications of CMP. It specifically deals with the development of m

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Book Categories

Authors

Introduction.- Review of CMP Modeling.- Material Removal Mechanism in CMP.- Effects of Abrasive Size Distribution in CMP.- Material Removal Regions in CMP.- One and Semi-Two Dimensional Feature- and Die-Scale Modeling for the Damascene Process.- Three-Dimensional Feature-Scale Modeling of CMP.- Wafer-Scale Modeling of CMP.- Summary and Future work.

Title: Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication:: From Particle Scale to Feature, Die & Wafer Scales

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Steidl Publishing

Item Number: 9783642061158

Number: 1

Product Description: Full Name: Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication:: From Particle Scale to Feature, Die & Wafer Scales; Short Name:Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication

Universal Product Code (UPC): 9783642061158

WonderClub Stock Keeping Unit (WSKU): 9783642061158

Rating: 4/5 based on 1 Reviews

Image Location: https://wonderclub.com/images/covers/11/58/9783642061158.jpg

Category: Media >> Books

Weight: 0.200 kg (0.44 lbs)

Width: 0.700 cm (0.28 inches)

Heigh : 9.210 cm (3.63 inches)

Depth: 6.140 cm (2.42 inches)

Date Added: August 25, 2020, Added By: Ross

Date Last Edited: August 25, 2020, Edited By: Ross

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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication:: From Particle Scale to Feature, Die & Wafer Scales, This book is the product of a developing research focus on CMP at Berkeley. Its focus is on the important area of process models which have not kept pace with the tremendous expansion of applications of CMP. It specifically deals with the development of m, Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication:: From Particle Scale to Feature, Die and Wafer Scales

Add Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication:: From Particle Scale to Feature, Die & Wafer Scales, This book is the product of a developing research focus on CMP at Berkeley. Its focus is on the important area of process models which have not kept pace with the tremendous expansion of applications of CMP. It specifically deals with the development of m, Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication:: From Particle Scale to Feature, Die and Wafer Scales to the inventory that you are selling on WonderClub

Add Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication:: From Particle Scale to Feature, Die & Wafer Scales, This book is the product of a developing research focus on CMP at Berkeley. Its focus is on the important area of process models which have not kept pace with the tremendous expansion of applications of CMP. It specifically deals with the development of m, Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication:: From Particle Scale to Feature, Die and Wafer Scales to your collection on WonderClub

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