EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging December 11-14, 2005, Tokyo Institute of Technology, Tokyo, Japan [proceedings] Book

Name: EMAP 2005: 2005 International Symposium on Electronics Materials
Brand: WonderClub
SKU: 9781424401079
Price: 99.99 USD
Availability: InStock
Rating: 4 (1 reviews)

EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging December 11-14, 2005, Tokyo Institute of Technology, Tokyo, Japan [proceedings], , EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging December 11-14, 2005, Tokyo Institute of Technology, Tokyo, Japan [proceedings]

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EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging December 11-14, 2005, Tokyo Institute of Technology, Tokyo, Japan [proceedings]
Written by author Unknown
Published by IEEE, January 2005

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Title: EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging December 11-14, 2005, Tokyo Institute of Technology, Tokyo, Japan [proceedings]

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Item Number: 9781424401079

Publication Date: January 2005

Number: 1

Product Description: Full Name: EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging December 11-14, 2005, Tokyo Institute of Technology, Tokyo, Japan [proceedings]; Short Name:EMAP 2005

Universal Product Code (UPC): 9781424401079

WonderClub Stock Keeping Unit (WSKU): 9781424401079

Rating: 4/5 based on 1 Reviews

Image Location: https://wonderclub.com/images/covers/10/79/9781424401079.jpg

Category: Media >> Books

Weight: 0.200 kg (0.44 lbs)

Width: 0.000 cm (0.00 inches)

Heigh : 0.000 cm (0.00 inches)

Depth: 0.000 cm (0.00 inches)

Date Added: August 25, 2020, Added By: Ross

Date Last Edited: August 25, 2020, Edited By: Ross

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