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Book Categories |
| Preface | ||
| 1 | Design and Materials Options for High Density Multichip Modules | 1 |
| 2 | Diffusion and Aggregation of Copper in Polymers | 41 |
| 3 | Dielectric Properties of Polymers | 73 |
| 4 | Plasma Etching and Modification of Polymers | 119 |
| 5 | Fluid Mechanical Aspects of Soldering Processes | 169 |
| 6 | Electromagnetic Modeling of Packaging Interconnections | 189 |
| 7 | Modeling and Simulation of Interconnect Structures on Multichip Modules | 245 |
| 8 | A Family of Assembly Test Chips | 265 |
| 9 | Low Cost Electronics Packaging for the Severe Automotive Environment | 287 |
| 10 | Real Time Computer Aided Measurement of Thermal Properties in Composite Plates | 303 |
| 11 | Tribology in Electronics Packaging | 339 |
| 12 | The European Community (EC) | 363 |
| Index | 385 |
| Price | Condition | Delivery | Seller | Action |
| $99.99 | Digital |
| WonderClub |
Rusty Shackleford
reviewed Electronics Packaging Forum Multichip Module Technology Issues on June 05, 2021
Electronics Packaging Forum Multichip Module Technology Issues
Let’s pick up a Victorian-era book about the History of Faerie folk they said...
It will be fun they said...
OH GOD WHY WHY WHY IS THERE SO MUCH RACISM?
(And to clarify, it was the wee little Faerie folk who told me to pick it up...)
Honestly though, there are some interesting stories in here once you weed through all the racist bullshit, and there is a lot of that to weed through.
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Add Electronics Packaging Forum Multichip Module Technology Issues, Keep up with the leading-edge technology with this practical volume, which brings a multidisciplinary treatment to the field of electronic packaging and multichip modules. The most comprehensive resource on packaging now, the volume uses real-world exampl, Electronics Packaging Forum Multichip Module Technology Issues to the inventory that you are selling on WonderClubX
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Add Electronics Packaging Forum Multichip Module Technology Issues, Keep up with the leading-edge technology with this practical volume, which brings a multidisciplinary treatment to the field of electronic packaging and multichip modules. The most comprehensive resource on packaging now, the volume uses real-world exampl, Electronics Packaging Forum Multichip Module Technology Issues to your collection on WonderClub |
